LSM6DSV32XTR, STMicroelectronics | 6‑Axis IMU Inertial Measurement Unit (3‑Axis Accelerometer + 3‑Axis Gyroscope)

- **Package**: LGA‑14L, 2.5×3.0×0.83 mm, SMD surface‑mount

- **Accelerometer Full‑scale Range**: ±4 / ±8 / ±16 / ±32 g (Key difference vs LSM6DSV16X with max 16 g), 16‑bit ADC, noise 80 μg/√Hz

Output Interface**: I2C, SPI, MIPI I3C v1.1; Auxiliary SPI dedicated for OIS optical image stabilization output

Supply Voltage**: Analog: 1.71 V‑3.6 V; I/O: 1.08 V‑3.6 V, compatible with 1.8 V / 3.3 V host MCUs

Operating Temperature**: ‑40 ℃ ~ +85 ℃ (Consumer / light‑industrial grade, non‑automotive, not 105 ℃ wide‑temperature industrial grade)

On‑chip Hardware Resources**

1. MLC (Machine Learning Core) for on‑chip AI motion recognition

2. FSM (Finite State Machine) for custom motion event configuration

3. ASC Adaptive‑Self‑Configuration: chip auto‑switches operating modes without MCU intervention

4. Sensor Hub for connecting external sensors

5. Qvar charge sensing: supports single‑tap, double‑tap, triple‑tap, long‑press and swipe gestures, no extra touch IC required

6. Built‑in temperature sensor and self‑test function

Three‑channel Independent Processing Architecture**: UI user‑interaction channel, OIS optical‑image‑stabilization channel, EIS electronic‑image‑stabilization channel. Three independent filter configurations, key feature for smartphone cameras.

Embedded Event Detection**: Free‑fall, high‑g shock detection, wake‑up, tilt, 6D/4D orientation, single‑tap / double‑tap, advanced pedometer

Power Consumption**: Typical 0.65 mA in 6‑axis high‑performance mode; Always‑On low‑power architecture, standby current only 3 μA

 Functions

Output raw acceleration and angular‑rate motion data. Leveraging on‑chip MLC/FSM/ASC, the chip locally performs motion recognition, shock & drop detection and attitude pre‑processing to reduce host‑MCU computing load.

Unique Qvar electrostatic gesture detection. Three‑channel architecture supports user interaction together with OIS / EIS camera stabilization.

Major difference from LSM6DSV16X: Accelerometer full‑scale range increased up to 32 g, better suited for shock, drop and high‑intensity motion scenarios.

 Application Fields

 Main Consumer‑electronics Markets

1. High‑end smartphones: OIS optical image stabilization, EIS electronic image stabilization, gesture interaction, drop detection

2. TWS earbuds, smartwatches & sports wearables: Motion recognition, high‑dynamic‑motion detection such as racket swing / jump, pedometer and fall detection

3. AR/VR/MR controllers, motion‑sensing remote controls: Attitude tracking and gesture recognition

4. Action cameras, small drone gimbals: Attitude detection and stabilization under fast rotation and heavy vibration

 IoT & Light‑industrial Scenarios

1. Asset trackers: Drop‑shock monitoring, cargo transportation status monitoring

2. Auxiliary inertial navigation for small mobile robots and AGVs

3. Industrial handheld terminals and portable test equipment (Note: max operating temperature 85 ℃, not applicable for high‑temperature industrial environments)