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LIS2DWLTR (STMicroelectronics‑ST) 3‑Axis MEMS Accelerometer

LIS2DWLTR (STMicroelectronics‑ST) 3‑Axis MEMS Accelerometer
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Project Parameters

‑ Measurement Axes: X/Y/Z 3‑axis acceleration

‑ Full‑Scale Range (configurable): ±2 g / ±4 g / ±8 g / ±16 g

‑ Output Resolution: 16‑bit

‑ Communication Interfaces: I2C, SPI

‑ Package: LGA‑12, 2.0 × 2.0 × 0.7 mm

‑ Supply Voltage: VDD 1.62 V‑3.6 V; independent IO supply for 1.8 V system support

‑ Power Consumption: Power‑down sleep: 50 nA; low‑power always‑on: 0.38 μA; high‑performance mode: 90 μA

‑ Noise: 1.3 mg RMS noise in low‑power mode

‑ Output Data Rate (ODR): 1.6 Hz ~ 1600 Hz

‑ On‑chip Features: Single‑tap / double‑tap detection, wake‑up / sleep, free‑fall, 6D orientation detection, 32‑level FIFO, dual interrupts INT1/INT2, on‑chip temperature sensor, self‑test

‑ Operating Temperature: ‑40 ℃ ~ +85 ℃

‑ Shock Resistance: 10000 g

Applications

Consumer Wearables (Primary Market)

TWS Bluetooth earbuds & charging cases: open‑lid detection, wear detection, tap / double‑tap control, sleep & wake‑up

Smart bands & smartwatches: step counting, raise‑to‑wake screen, sleep monitoring, orientation recognition

Smart rings, smart glasses, active styluses

Smart Home & IoT

‑ Bluetooth remote controllers: orientation sensing, tap‑to‑wake, auxiliary key‑press recognition

‑ Door / window and object orientation detection, basic vibration monitoring, asset tags

Others

‑ Portable battery‑powered devices: drop detection, screen rotation

Not Suitable For: Flight controller applications (flight controllers require IMU combining accelerometer + gyroscope, e.g. ISM330DHCX, LSM6DSV16X); industrial high‑shock scenarios.
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