LSM6DSV 320 X 6-axis inertial measurement unit (IMU) can replace TDK ICM-4 2688- P

ST six-axis gyroscope | LSM6DSK32XTR | IMU | Replaces TDK ICM-43688-P

LSM6DSK 320 XTR | ST six-axis gyroscope | IMU | Replaces TDK ICM-4 2688- P

LSM6DSV 320X 6-axis inertial measurement unit (IMU)

The STMicroelectronics LSM 6DSV32X 6-axis inertial measurement unit (IMU) is a complex IMU that integrates a 3-axis digital low-g accelerometer, a 3-axis high-g accelerometer, and a 3-axis gyroscope. STMicroelectronics IMUs are designed to provide precise motion detection and sensor fusion capabilities, making them ideal for use in automotive collision detection, motion monitoring, and Internet of Things (IoT) devices. LSM6DSV 320X adopts a four-channel architecture, which can process acceleration and angular velocity data on four independent channels, each with dedicated configuration, processing, and filtering functions. In addition, the device realizes configurable motion tracking through a finite state machine (FSM) and context-awareness through a machine learning core (MLC), thus supporting embedded artificial intelligence and sensor fusion functions.

LSM6DSV 320X is equipped with adaptive self-configuration (ASC) function, which can automatically reconfigure the device in real time according to the specific motion mode or decision tree output of MLC. The IMU also includes a dedicated high g-value accelerometer sensor that enables high g-value impact detection, making it suitable for applications that require robust impact detection. Other features worth noting include intelligent FIFO, with a capacity of up to 4.5KB, enabling efficient data management; And a series of standard interrupt functions, such as free fall, wake-up, 6D/4D orientation, click/double click, high g-force wake-up, and high g-force impact detection. The LSM6DSV32X is designed to optimize system power consumption while providing an always-aware smart experience.

Characteristic

· Four-channel architecture for UI, EIS, OIS, and high g-value data processing to optimize system power consumption and provide an always-aware intelligent experience

The intelligent FIFO supports up to 4.5KB data buffer, which can achieve 2 to 3 times data compression with 100% efficiency.With flexible configuration and partitioning, it can store timestamp, dual accelerometer channels, low g-value channels: ±2g, ±4g, ±8g, and ±16g full-scale, high g-value channels: +32g, +64g, +128g, +256g, and ±320g full-scale, ±250d/s, ±500d/s,+1000 dps, +2000 dps and ±4000 dps full-scale SPI/I2C and MIPII3Cv 1.1 serial interface, with main processor data synchronization function auxiliary SPI and MIPII3CV1.1, for gyroscope and accelerometer OIS data output sensor hub, supports up to six sensors two internal (accelerometer and gyroscope)

Four external sensors

The OIS can be configured through the auxiliary interface or the main interface. The EIS dedicated channel on the main interface is equipped with a dedicated filtering function, an advanced pedometer, a step detector, and a step counter.

Severe motion detection, tilt detection

Characteristic

Free fall, wake-up, 6D/4D orientation, click/double click, high g-force wake-up and high g-force impact

Interrupt for event detection (fully configurable)

Programmable finite state machine, for accelerometer (high g-value and low g-value), gyroscope and external

Sensor data processing, rate up to 960Hz

Machine learning kernel, supports feature and filter export, suitable for artificial intelligence applications

Embedded adaptive self-configuration (ASC) embedded sensor fusion low power (SFLP) algorithm

Embedded temperature sensor

Independent I / O power supply

I2C voltage range: 1.62V to 3.6V

Six-axis configuration of power supply current under high-performance mode: 0.67m A

SPI / MIPI13C extended voltage range: 1.08V to 3.6V

Nine-axis configuration: 0.80 mA

HBMESD protection: 2kV (maximum)

Operating temperature range: -40°C to +85°C

Compact 2.5mm x 3mm x 0.83mm 14L LGA package

Compliant with ECOPACK and RoHS standards

application

·loT and connected devices

Asset tracking

Smartphones and handheld devices

Automobile collision and impact detection

Wearable devices

, motion tracking and gesture detection

Augmented reality (AR), virtual reality (VR), mixed reality (MR) applications

Indoor navigation

EIS and OIS for camera applications

Vibration monitoring and compensation

ST (STMicroelectronics) sensors; 3D accelerometer; Temperature sensing; ST sensor; Sensor Gyroscope

LIS2DWLTR

LSM6DSV16XTR

LSM6DSV32XTR

L9663-TR-1

L9369-TR

LSM6DSOETR3

LSM6DSK320XTR

ISM330DHCXTR

ASM330LHHTR

SPC584B70E3EHC0X

STM32H563MIY3QTR

STM32F0316DIE1

STM32G473VCT6

STM32H7B0ZBT6

STM32L053R8T6

STMicroelectronics Sensors | 3D Accelerometers | Temperature Sensors | Gyroscopes & Inertial Modules

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