MLG1005SR18JTD25 TDK Multilayer Ceramic High-Frequency RF Chip Inductor

1. What Component Is This

TDK Multilayer Ceramic High-Frequency RF Surface Mount Chip Inductor (RF Inductor)Series: MLG1005S (Metric 1005 / Imperial 0402 footprint), compliant with AEC-Q200 automotive qualification standards. It adopts a monolithic co-fired ceramic structure, specially designed for RF and high-frequency signal circuits, and is not a power inductor for power supply circuits.

Model Breakdown

• MLG: TDK series of high-frequency RF multilayer inductors

• 1005: Dimension 1.0×0.5mm (Imperial 0402)

• S: Ultra-thin type, maximum thickness 0.5mm

• R18: Inductance value 0.18μH = 180nH

• J: Tolerance ±5%

• T: Tape-and-reel packaging

• D25: Standard reel specification

2. Key Electrical Specifications

表格

3. Core Functions (RF-Dedicated)

1. RF Impedance MatchingUsed in antennas, Bluetooth/Wi-Fi circuits, RF power amplifiers (PAs) and VCO oscillator circuits. Form LC matching networks with capacitors to maximize RF signal transmission power and reduce signal reflection loss.

2. High-Frequency Filtering & Harmonic SuppressionEliminates high-order harmonics and spurious interference generated in RF circuits, prevents signal crosstalk and improves receiving sensitivity.

3. RF ChokeBlocks high-frequency RF signals from leaking into DC power supply lines while allowing DC bias current to pass normally, isolating power supply and RF signal paths.

4. LC Oscillation CircuitApplied to resonant circuits of wireless transceivers, FM tuners and UWB positioning modules.

Note: Not suitable for energy storage in high-current DC-DC power supplies. It features high DCR and low saturation current, and is only used for RF signal processing rather than step-up/step-down power conversion.

4. Scope of Application

1. Consumer Mobile Communication (Main Application)

• RF front-end FEM and antenna matching circuits of 5G/4G smartphones and tablets

• Wi-Fi 6/7, Bluetooth/BLE, Zigbee wireless modules

• UWB indoor positioning and NFC RF read-write circuits

• RF circuits of wireless earbuds, smart watches and wearable devices

2. Automotive Electronics (AEC-Q200 Qualified)

• Vehicle Bluetooth, on-board Wi-Fi and T-BOX V2X modules

• Auxiliary RF filtering for car remote keys and millimeter-wave radars

• RF isolation circuits for on-board wireless charging

3. Industrial / IoT / Medical Devices

• RF links for drone remote control and wireless sensor nodes

• Smart electricity meters and industrial wireless collectors

• Portable medical wireless monitoring equipment and handheld walkie-talkies

4. Audio-Visual & Communication Equipment

• FM RF tuners for TVs and set-top boxes, RF boards of compact routers

• Wireless image transmission modules for digital cameras and action cameras

5. Core Product Features

1. Monolithic co-fired ceramic construction with dense structure, excellent high-frequency stability and low parasitic capacitance.

2. Ultra-thin 0.5mm thickness, ideal for slim and portable devices.

3. AEC-Q200 automotive-grade reliability with stable performance under wide temperature fluctuations.

4. High self-resonant frequency of 500MHz, covering mainstream 2.4GHz Bluetooth/Wi-Fi frequency bands.

5. Standard 0402 package, universal surface mount, compatible with automated assembly lines.