Power Management Products: TDK Expands Lineup for High-Density AI Edge Systems

Compact micro POL Module FS3303 features a footprint of just 2.5 × 2.5 mm and a height of only 1.2 mm. Delivering up to 3 A output current, it enables high-density power supply for optical modules and AI edge systems.

It achieves a peak efficiency of up to 95%, with a maximum operating ambient temperature of +90 °C (+125 °C under derated operation). Supporting low-voltage output from 0.4 V to 3.3 V, it is well-suited for ASICs, SoCs, DSPs and AI chipsets.

Integrated with controllers, drivers, MOSFETs and inductors via TDK’s advanced 3D embedded die packaging technology, this module minimizes external components and saves valuable PCB space.

TDK Corporation (TSE: 6762) announces the launch of the FS3303, the first product in a major expansion of its ultra-compact non-isolated DC-DC power modules within the micro POL lineup. This series is engineered for optical modules deployed in AI edge systems and other space-constrained designs.

Measuring merely 2.5 × 2.5 mm in size and 1.2 mm in height, the FS3303 delivers 3 A output current at ambient temperatures up to +90 °C, or up to +125 °C under derated conditions, while boasting a peak efficiency of approximately 95%. The FS3303-0400-AL is now in full production, and samples are available through major distributors.

The FS3303, together with the upcoming high-performance Point-of-Load (POL) converter portfolio, offers output currents ranging from 3 A to 80 A across an operating voltage range of 0.3 V to 3.3 V.

These solutions empower next-generation optical networking and AI accelerator platforms to boost performance without compromising PCB real estate.

For instance, the data rate of compact optical modules has increased from 10 Gbit/s to 1.6 Tbit/s. The new product lineup features a height profile ranging from 1.2 mm to 1.7 mm.

Designed for low-voltage power rails, the FS3303 accepts an input voltage of 2.7 V to 6 V and provides an output voltage of 0.4 V to 3.3 V.

This makes it an ideal solution for ASICs, SoCs, DSPs and cutting-edge AI chipsets, especially for versatile applications requiring tight voltage regulation and superior transient response performance.

Leveraging TDK’s proprietary 3D embedded die packaging technology, the FS3303 integrates controllers, drivers, MOSFETs and power inductors in a single package.

This architecture drastically reduces the need for external components and forms a complete DC-DC solution. It substantially cuts down PCB footprint and component height, making it perfect for next-generation optical transceivers and edge AI modules.