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TPS82084SILR: TI (Texas Instruments) MicroSiP™Integrated Inductor Synchronous Buck Power Supply Modu

TPS82084SILR: TI (Texas Instruments) MicroSiP™Integrated Inductor Synchronous Buck Power Supply Module

I. Model Disassembly

TPS: TI Power Module Series

82084: Device body model, Version 2A; Same series pin-to-pin upgraded version: TPS82085 (3A)

SIL: Package code USIP-8 (MicroSiP), 8-pin

R: Tape & Reel, one reel with 3000 pieces.

II. Core Electrical Parameters

form

project

parameter

topology

Synchronous Buck step-down module (with built-in inductor and MOSFET)

Maximum output current

2A

Input voltage \( V_{in} \)

2.5V ~ 6V

Output voltage, Vout

0.8V ~ Vin (external resistance adjustable)

Nominal switching frequency

2.4MHz

Control architecture

DCS-Control™ (COT: Constant On-Time)

efficiency

Up to 95%

Light-load static current

Typical 17μA (PSM power-saving mode)

Operating temperature

-40℃ ~ +125℃

Duty cycle

Up to 100% (Low Dropout LDO Mode)

Built-in protection features

Soft start: Typical 0.8ms, suppresses power-on surge, supports pre-bias output capacitor startup.

Hiccup mode short-circuit protection: Repeated restarts during short circuits to reduce heat generation.

Thermal shutdown: shuts down when junction temperature exceeds the limit, and automatically recovers after cooling down.

UVLO (Undervoltage Lockout): Prevents startup when input voltage is insufficient.

EN enable pin, shutdown static current 0.7μA, with built-in output discharge during shutdown.

PG power normal indication pin, used for power sequencing monitoring and multi-track power-on sequencing.

III. Encapsulation and Appearance Form

Packaging: USIP (SIL)-8 MicroSiP module, QFN-like surface-mount package, with bottom pads for heat dissipation.

Dimensions: 2.8mm × 3.0mm, with a thickness of only 1.3mm, ultra-thin.

Pin plating: NiAu (Nickel-Gold)

MSL Rating: Level 2, 260°C reflow soldering, shelf life of 1 year.

Packaging: Reel tape, 3000 pcs/reel, SMT (Surface Mount Technology) auto-mounting friendly, Texas Instruments.

Structural Features: The chip, power MOS, and power inductor are all encapsulated within the module. No external power inductor is required on the PCB; only input/output capacitors and voltage divider resistors are needed to set the output voltage, significantly reducing the PCB area.

IV. Working Principle Highlights: DCS-Control™

DCS-Control is a distinctive control technology of TI:

Heavy-duty: PWM fixed at approximately 2.4 MHz, with low ripple and fast transient response, suitable for RF and high-speed digital circuits.

Light Load: Seamless automatic switching to PSM energy-saving mode, reducing switching frequency and lowering static current, resulting in better battery product endurance.

PWM/PSM switching is smooth, with minimal output voltage disturbance, making it power-friendly for RF modules. It is suitable for RF module-sensitive power supplies. TI E2E support...

V. Typical Application Scenarios

Portable devices, battery-powered products (3.7V lithium battery voltage regulator)

FPGA, MCU, RF chips, and core power supply for sensors.

Industrial small modules, IoT modules, wearable devices

5V system conversion to 1.8V / 1.2V / 2.5V core power supply

Suitable for projects with space constraints, aiming to shorten power design cycles and reduce discrete component materials.

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