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MP9943GQ‑Z|MPS CoreSource System Device Type: Synchronous Buck Converter, Built-in High-Side and Low

MP9943GQ‑Z|MPS CoreSource System Device Type: Synchronous Buck Converter, Built-in High-Side and Low-Side

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II. Core Performance Parameters

form

project

parameter

Measurement range

±2g / ±4g / ±8g / ±16g, software-switchable STMicroele...

Output rate ODR

1.6Hz~1600Hz, multiple levels selectable, STMicroele...

Data output

16-bit digital output, STMicroelectronics.

noise

Low-power mode: 1.3 mg RMS;High-performance mode, 90 μg/√Hz, STMicroele...

Supply voltage

VDD:1.62‑3.6V; IO port with independent power supply, STMicroelectronics.

electric consumption

Leakage current: 50 nA;Low-power operation < 1 μA;High-performance mode: approximately 90 μASTMicroele...

interface

I²C + SPI dual interfaces, 2 interrupt lines (INT1/INT2)

On-chip resources

32-level FIFO buffer, built-in temperature sensor, self-test function, STMicroele...

III. Built-in Hardware Function Engine (Core Highlight)

The chip features a built-in motion detection hardware engine, eliminating the need for continuous MCU computation and directly outputting interrupt signals, thereby significantly reducing the main controller's load and system power consumption. Shenzhen Shilian...:

Single/tap or double-tap gesture recognition

Free fall detection

Wake-up / Sleep (Activity-Idle Detection)

4D/6D Orientation Detection (Portrait and Landscape Modes)

Android Standard Stillness Detection

Self-Test, production line/full machine self-test sensor functionality check, STMicroele...

The Level 32 FIFO can cache multiple sets of tri-axis data, eliminating the need for frequent MCU reads. It supports scheduled batch readings, further reducing power consumption, making it suitable for battery-powered devices. Shenzhen Shilian....。

IV. Main Application Scenarios

Wearable devices: wristbands, hearing aids, portable health monitoring devices, step-counting devices, Shenzhen Shilian...

IoT wireless sensor nodes, battery-powered low-power terminals

Handheld devices: posture switching, tapping gestures, drop protection

Industrial low-power vibration and tilt detection

Smart home, remote control gesture activation.

Positioning: It focuses on always-on ultra-low-power motion detection, which is not about high-frequency vibration acquisition but rather better suited for low-power event detection.

V. PCB Design Considerations

The LGA pad spacing is 0.5mm, and PCB libraries must strictly match ST's official recommended packages to avoid cold solder joints;

Place a 0.1μF decoupling capacitor near the power pins to ensure noise specifications are met;

High-speed SPI routing should not pass directly beneath the chip to avoid crosstalk that could introduce false steps;

The VDD and VDD‑IO power supplies must be powered on simultaneously;

The two interrupt pins can be configured for various event triggers and can be pulled up to the IO domain voltage.


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