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CGA1A1X7S1E104K030BC TDK Automotive‑Grade Multilayer Chip Ceramic Capacitor (MLCC)

CGA1A1X7S1E104K030BCTDK Automotive‑Grade Multilayer Chip Ceramic Capacitor (MLCC)
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Key Parameters (Part Number Decoding)

Series: CGA = Automotive‑Grade (AEC‑Q200), Low‑ESL, Soft‑Termination Electrode

Size: 1 = 0603 (0201), 0.6×0.3×0.3 mm

Thickness: A = 0.3 mm

Dielectric: X7S = Temperature characteristic ±22% (−55 ℃ ~ +125 ℃)

Rated Voltage: 1E = 25 V DC

Capacitance: 104 = 100 nF (0.1 μF)

Tolerance: K = ±10%

Termination: BC = Soft‑termination (Thermal‑shock resistant, bend‑crack resistant)

II. Core Functions

Power supply decoupling / filtering: Suppress power‑supply noise, stabilize voltage, reduce ESR/ESL, deliver excellent high‑frequency noise reduction performance.

EMC countermeasure: Broad‑band noise suppression, mitigate EMI interference and improve system anti‑interference capability.

Smoothing / voltage stabilization: Smooth voltage in power circuits of automotive ECUs, BMS and other modules to reduce ripple.

Coupling / DC blocking: Block DC and pass AC in signal paths to protect post‑stage circuits.

III. Application Scope

✅ Automotive Electronics (Primary Application)

Powertrain domain: Engine ECU, BMS, OBC, DC‑DC

Chassis / Safety: ABS, ESP, ADAS, autonomous‑drive domain controller

Body / Cockpit: Instrument cluster, infotainment head‑unit, BCM, automotive lighting, car navigation, T‑Box

✅ Industrial & High‑end Consumer

Industrial control: PLC, servo drives, sensors, industrial power supplies

High‑end equipment: Medical instruments, communication base stations, security systems, smart home control boards

High‑reliability scenarios: Equipment requiring vibration resistance, wide temperature range (−55 ℃ ~ +125 ℃) and resistance to stress‑induced cracking

IV. Key Advantages

Automotive qualification: AEC‑Q200 compliant, meeting automotive reliability requirements

Low ESL / Low ESR: Reverse‑geometry construction with low impedance for high decoupling efficiency

Soft‑termination electrode: Resin layer absorbs stress, resists PCB bending and thermal‑shock cracking

Temperature stability: X7S dielectric, capacitance variation ≤±22% over −55 ℃ ~ +125 ℃
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