TAS300 is a 300mm wafer load port manufactured by TDK, which belongs to front-end semiconductor equipment.

he TAS300 is a 300mm semiconductor wafer FOUP Load Port developed and manufactured by TDK. It is deployed in 12-inch wafer fabs to automatically dock and open standard Front Opening Unified Pods (FOUPs), enabling robotic handlers of process tools to load and unload wafers. It serves as a standard interface device for semiconductor front-end processes.

I. Key Specifications (Type J1 / E4 / E4A)

Applicable Wafer Size: 300mm (12-inch)

Compatible FOUP Standards: SEMI E47.1 / E62; compatible with mainstream brands including Entegris, Shin-Etsu, Miraial and Ohkura Shoji.

Driving System: Pneumatic air cushion drive (motorless), low particle generation and calibration-free.

Particle Performance: Model E4 achieves 0.0001 particles per wafer, leading the industry.

Cycle Time:Load completion → Wafer accessible: ≤ 8 secondsWafer accessible → Unload completion: ≤ 8 seconds

Dimensions (Type J1): 1386mm (H) × 472mm (W) × 493mm (D)

Weight: 30kg (excluding optional accessories)

Cleanliness Class: Class 1 per ISO 14644-1, fully enclosed design with laminar flow control.

Safety Monitoring: Obstacle detection at docking position, FOUP presence detection, door interlock system.

Optional Functions:

• Bottom N₂ Purge (TAS-BP): Reduces humidity and oxygen concentration to prevent wafer oxidation (mandatory for processes below 20nm).

• Optical Wafer Mapping: Automatically detects wafer presence in slots.

• SMIF Compatibility (E4A): Supports 200mm SMIF Pod.

II. Main Functions

The TAS300 acts as a fully automatic cleanroom access gateway for wafer fabs:

1. Automatic FOUP Docking: High-precision positioning, adsorption and locking to eliminate manual errors.

2. Particle-Free Door Opening: Pneumatic & air cushion structure generates nearly zero particles to guarantee yield of 300mm wafers.

3. Wafer Transfer Interface: Provides a standardized and ultra-clean channel for tool robots to handle wafers.

4. Isolation & Protection: Blocks external contamination and stabilizes internal microenvironment (temperature, humidity and oxygen level).

5. Productivity Improvement: High-speed cycle and superior stability minimize downtime and cut operational costs.

III. Application Scope

1. Target Industries

• 12-inch semiconductor wafer fabs (core application): Logic ICs, memory chips and advanced process nodes (7nm – 28nm).

• Advanced packaging: FC-BGA, 2.5D / 3D packaging.

• Display panels, photovoltaic and LED industries (large-size substrates).

2. Process Stages

Standard configuration for front-end equipment including photolithography, etching, deposition, ion implantation, CMP, inspection and metrology systems.

3. Compatible Equipment Brands

Fully compatible with process tools from leading manufacturers such as AMAT, TEL, Samsung, TSMC, SMIC, YMTC and CXMT.

4. Process Nodes

• Mandatory for advanced processes (14nm / 7nm / 5nm): Excellent particle control plus N₂ purge function effectively prevents wafer oxidation.

• Optimizes yield and reduces maintenance costs for mature processes (28nm – 90nm).